SONY

Sony is pleased to introduce its new Surface Mount Technology (SMT) division for the North American market featuring the latest cutting edge pick & place chip mounting and PCB/PWB/PCA inspection technology. Sony has decided to enter the North American market after years of sales & marketing experience in Japan, China and other Asia markets. With over 3000 pick and place equipments currently installed in Asia, Sony is now committed itself to the N.A. customers by providing distinguish products and excellent customer support. Currently, Sony has sales representatives and service providers setup throughout North America.

Pick & Place Equipment Systems
The compact, high speed, pick and place equipments offers the highest degree of positioning precision of its kind. High operating speeds are accompanied by high-quality placement capabilities featuring a 40% performance increase over previous product generations. Also featured is non-stop operation with minimum derate through a newly developed Flying Vision & Flying Nozzle system, parts thickness inspection and selectable reflective/transmission part recognition. These characteristics ensure friendly handling of all your high-density mounting challenges with durability and freedom from costly maintenance.

PWB/PCB Visual Inspection
The fully automated inspection system optimizes production by providing flexible after-printer or before-reflow inspection. The unique compact design and high precision detection ability will fit easily into your new or current production lines. Utilizing Sony’s latest camera technology and ease of use software will make your integration worry free.